The last time we heard about Imbera Electronics was in the distant 2009, when the chip-packaging company announced a massive $15 Million round led by Conor Venture Partners, Northzone Ventures and Index Ventures.
The company specializes in embedded technology, which in its simplest terms means building computer and circuit board systems with dedicated functions. For example the insides of your iPhone is an embedded system of components. What the company does is basically getting more stuff into less space, while remaining efficient and cost-effective.
Chip-packaging company Imbera Electronics announced that it raised $15 million from NorthZone Ventures, Index Ventures and Conor Venture Partners. NorthZone led the round. Imbera is the developer of patented Integrated Module Board technology for 3-D semiconductor packaging
Previously Imbera had raised $2 million in a first institutional round and just under $1 million in seed money before that.
The newly raised money will go to kick start a new high-volume manufacturing operation in Sangsong-ri, South Korea, and to continue Imbera’s embedded technology evolution through its R&D activities located in Espoo, Finland.
According to VentureBeat Risto Touminen, Imbera’s chief technology officer, had worked on the technology as a student at the Helsinki University of Technology since 1999.
You can read more about Imbera’s chip packaging technology at VentureBeat here.
It’s good to see a Nordic VC’s Nordic VCs active, when the Venture Capital industry in Silicon Valley is coughing.